Effect of sintering parameters on the microstructure and thermal conductivity of diamond/Cu composites prepared by high pressure and high temperature infiltration  

作　　者：Hui Chen Cheng-chang Jia Shang-jie Li 

机构地区：[1]School of Materials Science and Engineering,University of Science and Technology Beijing [2]Shenzhen Haimingrun Industrial Co.,Ltd.

出　　处：《International Journal of Minerals,Metallurgy and Materials》2013年第2期180-186,共7页矿物冶金与材料学报（英文版）

基　　金：supported by the National Natural Science Foundation of China (No. 50971020);the National High-Tech Research and Development Program of China (No. 2008AA03Z505)

摘　　要：Pure Cu composites reinforced with diamond particles were fabricated by a high pressure and high temperature （HPHT） infiltration technique. Their microstructural evolution and thermal conductivity were presented as a function of sintering parameters （temperature, pressure, and time）. The improvement in interfacial bonding strength and the maximum thermM conductivity of 750 W/（m.K） were achieved at the optimal sintering parameters of 1200℃, 6 GPa and 10 min. It is found that the thermal conductivity of the composites depends strongly on sintering pressure. When the sintering pressure is above 6 GPa, the diamond skeleton is detected, which greatly contributes to the excellent thermal conductivity.Pure Cu composites reinforced with diamond particles were fabricated by a high pressure and high temperature （HPHT） infiltration technique. Their microstructural evolution and thermal conductivity were presented as a function of sintering parameters （temperature, pressure, and time）. The improvement in interfacial bonding strength and the maximum thermM conductivity of 750 W/（m.K） were achieved at the optimal sintering parameters of 1200℃, 6 GPa and 10 min. It is found that the thermal conductivity of the composites depends strongly on sintering pressure. When the sintering pressure is above 6 GPa, the diamond skeleton is detected, which greatly contributes to the excellent thermal conductivity.

关 键 词：metallic matrix composites particle reinforced composites COPPER diamonds INFILTRATION microstructuralevolution thermal conductivity 

分 类 号：TB33[一般工业技术—材料科学与工程]