低温共烧陶瓷基板制备技术研究进展  

Prograss of the research on LTCC technology for substrates.

作　　者：韩振宇[1] 马莒生[1] 徐忠华[1] 张广能[1] 

机构地区：[1]清华大学材料科学与工程系,北京100084

出　　处：《电子元件与材料》2000年第6期31-33,共3页Electronic Components And Materials

基　　金：国家自然科学基金! (698360 30 )

摘　　要：对LTCC (低温共烧陶瓷 )技术的特点及应用作了评述。对目前已研究和使用过的低介电常数和低烧结温度基板材料及综合性能 ,流延浆料有机添加剂进行了对比分析。描述了流延工艺过程和烧结过程。由于对基板材料选择的任意性 ,现有流变学模型的局限性 ,以及低温液相烧结动力学过程机理尚不清晰 ,因此完整清晰地揭示LTCC工艺的物理化学过程仍需作很多工作。The characteristics of LTCC technology are reviewed. The low sintering and low dielectrics substrate materials and their properties, and the organic additives for tape casting slurry are compared and analyzed. The tape casting technology and sintering technology are presented. Due to the random selection of substrate materials, the limitation of existing rheology models, and the unclear mechanism of low temperature sintering dynamics, much work have to be done to find out chemical and physical process of LTCC technology. (23 refs.)

关 键 词：低温共烧陶瓷基板 有机物添加剂 流延浆料 

分 类 号：TN405[电子电信—微电子学与固体电子学]