镍磷复合镀层的组织与磨损性能  

Structure of the Compound plating of Ni-P Alloy and Its Wearing Properties

作　　者：吴玉程[1] 魏纯金[1] 

机构地区：[1]合肥工业大学

出　　处：《表面技术》1991年第5期14-20,共7页Surface Technology

摘　　要：本文研究了化学镀镍磷合金复合碳化硅镀层的组织与磨损性能及机理。在镍磷合金化学镀液中,加入碳化硅粒子(3～5μm),形成复合镀层,且碳化硅粒子与镍磷基质机械结合,复合镀层保持镍磷合金的组织结构。复合镀层表现出更高的硬度,具有良好的耐磨性,随硬度的提高,耐磨性增加;在滑动磨损条件下,碳化硅粒子起抗磨作用,复合镀层抗磨粒磨损性能好。Thes paper studies the structure of the compound silicon carbide plating of electroless plating of Ni-p alloy as well as its wearing properties and mechanism. The compound plating is formed by means of adding silicon carbide particles to the electroless solution of Ni-P alloy. The mechanical combination of silicon carbide particles with Ni-P substrates keeps the structure of Ni-P alloy and improves the hardness of the alloy and wearing properties.

关 键 词：化学镀 镍磷合金 碳化硅 复合镀层 

分 类 号：TQ153.2[化学工程—电化学工业]