EDTA体系无氰碱性镀铜的电化学成核机理  

Electrochemical Nucleation of Cyanide-free Alkaline Copper Plating from EDTA Bath

作　　者：赵晴[1] 赵琳[1] 杜楠[1] 张传波[1] 王力强[2] 简志超 

机构地区：[1]南昌航空大学"轻合金加工科学与技术"国防重点学科实验室,南昌330063 [2]成都飞机工业(集团)公司制造工程部,成都610092 [3]江铜集团技术中心铜加工部,南昌330096

出　　处：《腐蚀与防护》2013年第3期220-222,共3页Corrosion & Protection

摘　　要：采用循环伏安法和计时电流暂态曲线研究了EDTA(乙二胺四乙酸)体系无氰碱性镀铜的电化学成核机理。结果表明,铜在玻碳电极上的沉积遵循3D"成核/生长"机制;计时电流暂态曲线分析表明,在高负电位下铜离子的结晶成核方式遵循瞬时成核机制,低负电位下则趋向遵循连续成核机制,且过电位增加会促进铜离子结晶形核,随最大电流Im增大,电结晶成核数增多。Electrochemical nucleation of cyanide-free alkaline copper plating from EDTA （ethylene diamine tetraacetic acid） bath was studied by means of cyclic voltammetry and chronoamperometry techniques. The deposition of copper follows three dimensional nucleation/growth mechanism. The analyzing of potentionstatic transients indicates that in the case of high negative potentials, the nucleation process of metal ions follows the instantaneous nucleation mechanism, in the case of low negative potentials, it is Close to the progressive nucleation mechanism, and with the increase in overpotential the copper ion crystal nucleation is promoted, the maximum current Im gradually increases and the number of crystal nucleation increases.

关 键 词：碱性镀铜 EDTA(乙二胺四乙酸) 计时电流法 电化学成核 

分 类 号：TQ153.14[化学工程—电化学工业]