基于纳米压痕法无铅焊锡连接各层材料力学性能的研究  

On the Mechanical Properties of Lead-Free Solder Joints Based on Nanoindentation

作　　者：肖革胜[1] 杨雪霞[1] 袁国政[1] 树学峰[1] 

机构地区：[1]太原理工大学应用力学与生物医学工程研究所,太原030024

出　　处：《实验力学》2013年第1期56-62,共7页Journal of Experimental Mechanics

基　　金：国家自然科学基金(11172195)资助;山西省国际科技合作项目(2010081016)资助

摘　　要：利用SMT全自动回流焊机和高温恒温试验箱,制备出经2次回流焊时效20天的Sn-0.7Cu/Cu焊点试件。采用纳米压痕法,对其焊点金属间化合物力学性能进行测试。根据Oliver-Pharr算法,利用接触刚度连续测量技术得到该化合物(IMC)的弹性模量及硬度,并与同种工况下的焊料及铜进行对比,发现其硬度明显大于二者。并得到了Sn-0.7Cu焊料、金属间化合物和Cu的室温蠕变速率敏感指数,对三者的蠕变性能做了对比分析,发现Sn-0.7Cu的室温蠕变速率敏感指数明显大于IMC和Cu。Solder joint specimens of Sn-0. 7Cu/Cu subjected to two times reflows and 20-day aging were prepared by using SMT full-automatic reflow welder machine and high temperature thermostat test chamber. Then the IMC （intermetallic compound） mechanical properties of the soldered spot were measured by using nanoindentation method. Based on the calculation method given by Oliver- Pharr and the continuous stiffness measurement （CSM）, elastic modulus and hardness of IMC were obtained. Comparison of mechanical properties among IMC and Sn-0.7Cu/Cu solder under the same conditions was carried out, respectively. Results show that the hardness of IMC is significantly greater than both Cu and Sn-0.7Cu. The creep strain rate sensitivity index of Sn-0.7Cu,IMC and Cu were also obtained, among which, the creep rate sensitivity index of Sn-0.7Cu is greater than both IMC and Cu.

关 键 词：金属间化合物 无铅焊点 力学性能 纳米压痕 蠕变速率敏感指数 

分 类 号：O34[理学—固体力学]