Sn-0.7Cu-1Ag无铅钎料压入蠕变行为的研究  

Investigation of Indentation Creep Behavior of Sn-0.7Cu-1Ag Lead-free Solder

作　　者：廖春丽[1] 

机构地区：[1]南充职业技术学院机电工程系,四川南充637000

出　　处：《铸造技术》2013年第3期256-258,共3页Foundry Technology

基　　金：四川省教育厅重点培育项目(07ZZ033)

摘　　要：采用自制蠕变装置,研究了Sn-0.7Cu-1Ag无铅钎料在温度为60～120℃,压力为30～50 MPa下的压入蠕变行为,并利用SEM和XRD对钎料蠕变前后组织的变化进行了分析。结果表明:随温度和应力的增加,钎料的蠕变速率增大;Ag在金属间化合物形成前期可以促进形核,后期可以阻碍晶粒的长大,起到细化晶粒的作用,从而增加了相界面,增加了滑移变形的阻力;Ag3Sn、Cu6Sn5两相呈弥散分布,对基体的变形起到阻碍作用。Ag的加入起到了细晶强化和弥散强化作用,极大地提高了钎料的抗蠕变性能。The indentation creep behavior of Sn-0.7Cu-lAg lead-free solder was investigated by a self-made apparatus at the temperature range of 60-120℃ and the pressure range of 30～50 MPa, and the changes of the microstructures of the lead-free solder before and after creep were analyzed by optical microscope, SEM and XRD. The results show that the creep rate increases as increasing temperature and pressure; Ag can stimulate nucleation in the earlier stage of intermetallic growth, and reject the grain growing in the later stage to refine structural grains, which increases the phase interface to result in the increase of the resistance to slip deformation; Ag3Sn and Cu6Sn5 phases dispersively distribute, which hinders the deformation of the substrate. Therefore, the doping of Ag play a role in fine-grain strengthening＇ and dispersion strengthening, and greatly improves creep properties of the lead-free solder.

关 键 词：SN-0 7Cu-lAg 无铅钎料 压入蠕变 

分 类 号：TG425[金属学及工艺—焊接]