Sn-Ag-Cu无铅钎料互连焊点的电迁移研究进展  

Developments of Electromigration of Sn-Ag-Cu Lead-free Interconnect Solder Joints

作　　者：王玲 刘晓剑[1,2] 万超 

机构地区：[1]中国电器科学研究院有限公司,广东广州510300 [2]哈尔滨工业大学深圳研究生院,广东深圳518129

出　　处：《电子工艺技术》2013年第2期73-78,共6页Electronics Process Technology

基　　金：广东省重大专项(项目编号:2010A080408005)

摘　　要：电迁移问题作为影响焊点可靠性的关键问题之一,容易导致焊点出现裂纹、丘凸和空洞等焊接缺陷。其失效机制有电流拥挤效应、焦耳热效应、极化效应和金属间化合物失效等。聚焦Sn-Ag-Cu系无铅钎料焊点的电迁移问题,介绍了这一领域电迁移的失效机制、影响因素和防止措施的研究现状,并展望了今后的研究发展趋势。As one of the key issues affecting the solder joint reliability, electro-migration problems can cause the failure in the form of solder joints crack, mound convex, voids and other defects. The failure mechanisms include current crowding effect, joule heating, polarization effects, and intermetallic compounds, and so on. Focused on the electromigration problems of Sn-Ag- Cu lead-free solder, comprehensively describe the failure modes, influencing factors and preventing measures of this area and outlook of its future research trends.

关 键 词：SN-AG-CU无铅钎料 电迁移 电流拥挤效应 焦耳热效应 极化效应 

分 类 号：TN60[电子电信—电路与系统]