熔制温度对CBS系微晶玻璃结构与性能的影响  

Effects of melting temperature on microstructure and properties of CaO-B_2O_3-SiO_2glass ceramics

作　　者：韦鹏飞[1] 杨晓莉[1] 郝凌云[1] 叶原丰[1] 冯志强[1] 

机构地区：[1]金陵科技学院材料工程学院,江苏南京210069

出　　处：《电子元件与材料》2013年第4期6-8,15,共4页Electronic Components And Materials

基　　金：金陵科技学院博士科研启动基金资助项目(No.JIT-B-201211)

摘　　要：采用高温熔融法制备CaO-B2O3-SiO2(CBS)微晶玻璃,考察不同熔制温度对该体系微晶玻璃结构和性能的影响。结果表明:熔制温度1 400～1 450℃,试样中存在少量未熔融的SiO2,有利于CaSiO3晶相的析出和晶粒细化,加速CBS系微晶玻璃致密化。熔制温度为1 450℃粉料,850℃烧结保温15 min所制CBS性能较优:体积密度为2.54 g.cm–3,相对介电常数为6.42,介电损耗为0.000 9。The CaO-B2o3-SiO2 glass ceramics were prepared by high-temperature melting method. The effects of melting temperature on microstructure and properties of CaO-B2O3-SiO2 system were discussed. The results show that the samples with melting temperature about 1 400- 1 450℃ can make CaSiO3 phase precipitation and grain refinement, and accelerate the CBS system densification due to little no-melting SiO2 exists in the glass sample. When the melting temperature is 1 450 ℃, a bulk density of 2.54 g . cm-3, a er value of 6.42 and a tan δ value of 0.000 9 （measured at 9.7 GHz） are obtained for CBS glass ceramics sintered at 850 ℃ for 15 min.

关 键 词：微晶玻璃 钙硼硅 熔制温度 低温共烧陶瓷 介电常数 介电损耗 

分 类 号：TM28[一般工业技术—材料科学与工程]