钼丝表面镀铂工艺的研究  

A Study of Platinum Plating on Molybdenum Wire Surface

作　　者：孙传富 刘新庆[2] 邵忠财[2] 

机构地区：[1]驻672厂军代室,黑龙江齐齐哈尔161000 [2]沈阳理工大学环境与化学工程学院,辽宁沈阳110159

出　　处：《电镀与环保》2013年第2期26-28,共3页Electroplating & Pollution Control

摘　　要：采用电镀方法在钼丝表面制备了结合力好的金属铂层。研究了工艺参数和预镀镍层对镀铂层结合力的影响,优化了镀液组成与工艺条件。采用SEM对镀铂层的表面形貌进行了表征。通过实验确定了镀铂的最佳工艺条件为:6mA/dm2,室温,15min。采用预镀镍的方法能够提高镀层与基体的结合力。A platinum coating with good binding strength was prepared on the surface of molybdenum wire by electroplating. The effects of process parameters and pre-nickel plating on the binding strength of platinum coating were investigated and the bath composition and process conditions were optimized. The surface morphology of the coating was characterized by scanning electron microscope （SEM）. The optimum process conditions for platinum were determined by experiment as： 6 mA/dm2 , room temperature, 15 min. The experimental results show that pre nickel plating can improve the binding strength between coating and substrate.

关 键 词：钼 镀镍 镀铂 结合力 

分 类 号：TQ153[化学工程—电化学工业]