添加剂对次磷酸钠无醛化学镀铜的影响  

Influence of Additives on Sodium Hypophosphite Formaldehyde-Free Electroless Copper Plating

作　　者：康东红[1] 唐有根[1] 罗玉良 黄远提[1] 

机构地区：[1]中南大学化学化工学院化学电源与材料研究所,湖南长沙410083 [2]中罗电子材料有限公司,广东东莞523050

出　　处：《电镀与环保》2013年第2期39-42,共4页Electroplating & Pollution Control

摘　　要：采用次磷酸钠作为还原剂,降低了催化剂硫酸镍的质量浓度,探讨了不同添加剂对镀层沉积速率、表面形貌、电化学性能的影响。结果表明:降低硫酸镍的质量浓度仍能保持较高的沉积速率,添加剂的加入很好地改善了镀层的形貌,可获得光亮粉色的镀铜层。The mass concentration of catalyst nickel sulfate was decreased by using sodium hypophosphite as reducing agent. Effects of different additives on coating deposition rate, morphology and electrochemical property were investigated. The results show that when the additive is added, the deposition rate remains higher though the mass concentration of nickel sulfate is reduced, the coating morphology improved, and a bright pink copper coating can be obtained.

关 键 词：化学镀铜 硫酸镍 次磷酸钠 添加剂 

分 类 号：TQ153[化学工程—电化学工业]