预镀铜对铝基电沉积镍层的影响  

The Effect of Pre-Cu-plating on Aluminum Base for Ni Electrodeposited Layer

作　　者：韩新博[1] 肖跃军 刘谦[1,2] 刘继文 赵巍[1] 张文良[1,2] 宋林红[1,2] 王雪[1,2] 廖震宇 

机构地区：[1]沈阳汇博热能设备有限公司,沈阳110043 [2]沈阳仪表科学研究院,沈阳110043

出　　处：《表面技术》2013年第2期80-83,共4页Surface Technology

摘　　要：为了改善铝基电沉积镍层的性能,在电沉积镍之前采用了预镀铜的工艺。通过SEM,EDS,划痕法和氦质谱检漏法等方法研究预镀铜层与化学浸锌层的相组成和组织形貌,以及各沉积镍层的气密性和结合力等性能。研究结果表明,预镀铜工艺的添加使电沉积镍层性能得到显著改善;镍层内表面光亮,气密性大大提高。In order to improve the performance of aluminum electrodeposited nickel layer, pre-eopper plating process was adopted before electrodeposited nickel. The testing techniques such as SEM, EDS, scarification, helium mass spectrometer leak detection method were used to study performance of the phase composition and microstructure of pre-copper plating layer compared with immersion zinc layer, to study airtightness and combination of the deposited nickel layers. The results show that eleetrodeposited nickel layer performance has been significantly improved as the addition of the pre-copper plating, nickel layer surface is brighter, the airtightness is greatly improved.

关 键 词：预镀铜 铝基 电沉积 浸锌 镀镍层 

分 类 号：TQ153.1[化学工程—电化学工业]