基于IC封装的Au凸点剪切断丝模拟及实验  

Simulation and Experiment of Shearing Wire of Gold Bump Based on IC Packaging

作　　者：刘曰涛[1] 魏修亭[1] 孙立宁[2] 

机构地区：[1]山东理工大学精密制造与特种加工省级重点实验室,山东淄博255049 [2]哈尔滨工业大学机器人技术与系统国家重点实验室,哈尔滨150080

出　　处：《半导体技术》2013年第4期306-311,共6页Semiconductor Technology

基　　金：国家高技术研究发展计划资助项目(2012AA040404);山东省自然科学基金资助项目(ZR2012FL03);哈尔滨工业大学机器人技术与系统重点实验室开放基金资助项目(SKLRS-2011-ZD-02)

摘　　要：为提高IC封装过程中钉头Au凸点制备效率,需对Au凸点的形成机理进行分析,得出影响Au凸点质量的各种工艺参数。采用有限元仿真与实验相结合的方法,针对不同的劈刀剪切速度模拟剪切断丝过程,并在实际的引线键合机上进行实验。结果显示劈刀剪切速度越大,劈刀剪切Au丝时所受的作用力越小,但减小幅度不大。分析表明,当劈刀以较低速度进行剪切断丝时,需要克服较大的位错滑移能,而随着速度提高,滑移系增多,Au丝获得的热量增多,使得材料的塑性降低,从而能够减小剪切断丝时的剪切力,但由于Au丝的直径较小,剪切速度相对剪切距离又较大,所以剪切力的减小幅度对剪切过程影响有限,而且不同的剪切速度均能得到共面性较好的钉头Au凸点。To improve the manufacturing efficiency of gold stud bump during IC packaging, analyzing the formation mechanism of gold stud bump is essential, to obtain the factors affecting the quality of gold stud bump. The model of capillary shearing wire was established by finite element simulation （FES） technology firstly. Finite element analysis is implemented for different velocity of capillary shearing. The results show that the acting force between the capillary and gold wire decreases with increasing the shearing velocity of the capillary. However, the difference of maximum and minimum acting force between the capillary and gold wire is very small. The analysis indicates that the bigger dislocation gliding energy is overcome when the shearing velocity is smaller. However, along with the higher velocity of shearing, the gliding system increases and then the heat of gold wire obtained also increases. And it results in the plasticity of gold decreases, and thus the shearing force decreases. Nevertheless, the diameter of gold wire is small, and relative to the whole shearing process, the decrease of shearing force according to the high velocity is limited. The good coplanarity gold stud bumps can be manufactured using different shearing velocities.

关 键 词：电子封装 Au凸点 剪切断丝 有限元仿真 IC 

分 类 号：TN305.93[电子电信—物理电子学]