非离子型表面活性剂对化学沉铜的影响  

Influence of nonionic surfactant on electroless copper deposition

作　　者：余霞[1] 胡光辉[1] 潘湛昌[1] 庞文萍[1] 魏志钢[1] 肖楚民[1] 张晃初 曾祥福 

机构地区：[1]广东工业大学轻工化工学院,广东广州510006 [2]胜宏科技(惠州)股份有限公司,广东惠州516211

出　　处：《电镀与涂饰》2013年第4期17-20,共4页Electroplating & Finishing

基　　金：广东省科技计划(2011B031000013);广东工业大学-胜宏科技(惠州)有限公司产学研项目资助

摘　　要：以黄铜片为基体进行化学镀铜,基础镀液组成和工艺条件为:CuSO4.5H2O10g/L,EDTA-2Na40g/L,NaOH12g/L,HCHO10mL/L,pH13.0,温度35°C,时间10min。研究了非离子型表面活性剂OP-10、曲拉通X-100和吐温-80对起镀时间、沉积速率、铜镀层韧性和晶粒细化的影响。结果表明,3种表面活性剂都会降低铜的沉积速率。质量浓度为1～9mg/L时,曲拉通X-100和OP-10都能使铜镀层的韧性改善和晶粒细化,同时延长起镀时间;吐温-80会显著降低铜的沉积速率,但对铜镀层韧性的影响不大。与曲拉通X-100和吐温-80相比,OP-10是较理想的沉铜韧性改善剂。Electroless copper plating was carried out with brass sheet as substrate. The basic bath composition and process conditions are as follows： CuSO4.5H2O 10 g/L, EDTA-2Na 40 g/L, NaOH 12 g/L, HCHO 10 mL/L, pH 13.0, temperature 35 ℃, and time 10 min. The effects of nonionic surfactants such as OP-10, Triton X-100, and Tween-80 on the starting time of copper deposition, deposition rate, ductility, and grain refinement of Cu coating were studied. The results showed that the three kinds of surfactant can reduce copper deposition rate. The ductility and grain refinement of copper coating are improved by Triton X-100 and OP-10 when their mass concentration is 1-9 mg/L, while the starting time of copper deposition is delayed. Tween-80 can reduce the deposition rate significantly but has little impact on the ductility of Cu coating. Compared to Triton X-100 and Tween-80, OP-10 is the favorable agent for ductility improvement of electroless Cu coating.

关 键 词：化学镀铜 非离子表面活性剂 沉积速率 韧性 

分 类 号：TQ153.14[化学工程—电化学工业]