快速固化环氧胶用聚酰胺固化剂的合成及性能  

The synthesis and properties of polyamide curing agent

作　　者：刘大娟[1] 肖建伟[1] 李桢林[2] 张雪平[2] 陈伟[2] 李静[2] 范和平[2] 

机构地区：[1]江汉大学,湖北武汉430074 [2]华烁科技股份有限公司,湖北武汉430074

出　　处：《印制电路信息》2013年第4期50-53,共4页Printed Circuit Information

摘　　要：采用熔融缩聚法合成新型聚酰胺,以二乙烯三胺、三乙烯四胺、二酸为原料制备聚酰胺,并对聚合产物结构进行了红外表征。讨论了反应温度、反应时间、原料配比对产物性能的影响,研究环氧树脂固化剂的最佳制备工艺,最后将文章合成的聚酰胺固化剂与二氨基二苯砜配制成复合固化剂。重点讨论复合固化剂的最佳配比及使用复合固化剂制备胶粘剂时,其最佳固化剂配比,通过实验方法确定胶膜在(150-170)℃下,10min内可完全固化。结果表明:当酸胺的物质量的配比为1:2时,酰胺化反应在180℃反应2h,所得固化剂的性能最好;复合固化剂4,4’一二氨基二苯砜(DDS):聚酰胺(PA)最佳配比为1:5时,环氧树脂与复合固化剂的质量比为10:1时,制备的环氧快速固化包封膜在(150-170)℃下,10min固化条件下,剥离强度为1.35N/mm,性能优良。制备的快速固化环氧包封膜固化速度快,综合性能良好,具有较高的剥离强度、合适的溢胶量、良好的耐焊性和耐酸碱性能,满足FPC生产的要求。Terephthalic acid,diethylenetriamine,triethylenetetramine were used as materials to prepare Polyamide through melt polycondensation in this paper. Their structures were studied with FTIR, and the effect of reaction temperature, reaction time, the ratio of raw material on the product performance have been discussed and the best routing of epoxy resin curing agent was also studied, finally, the synthesis of polyamide curing agent with diamino diphenyl sulfone were prepared composite curing agent. The results indicated that when the molal weight ratio of adipicacid terephthalic acid to was 1：2.0,amidation reaction lasted for 2 hours under 180℃, and the curing agent Composite curing agent of the best mixed mass ratio was1：5, the best mixed mass ratio of the Composite curing agent to epoxy resin was l：10,the fast curing epoxy cover-layer was cured inl50 - 170 ℃/10 min, the PS was 1.38N/ram,The preparation of epoxy fast curing cover-layer curing speed, good comprehensive performance, can meet the production requirements of FCCL.

关 键 词：聚酰胺 包封膜 快速固化 

分 类 号：TN41[电子电信—微电子学与固体电子学]