大功率LED强化散热技术进展  

Technology Progress on High-Power LED Strengthen Heat Dissipation

作　　者：沈忠良[1] 卢冰[1] 李思文[1] 钟英杰[1] 

机构地区：[1]浙江工业大学能源与动力工程研究所,浙江杭州310014

出　　处：《轻工机械》2013年第2期107-112,共6页Light Industry Machinery

摘　　要：从封装材料与技术、散热基板、热沉结构和壳体设计等四个方面,综述了强化散热技术最新进展。在现有材料的基础上,改良散热结构的研究较为丰富,是强化散热的关键点。从能源综合管理的角度,提出兼顾经济性、可靠性和实效性的散热设计思想,提出复合换热方式以及非稳态换热技术在LED散热上的应用有待研究。The latest advances were reviewed on strengthen heat dissipation from four aspects including the packaging materials and technology, the cooling substrate, the heat sink structure and shell design. On the basis of existing materials, improved heat dissipation structure is the key point for strengthening heat dissipation, and the research on heat sink structure is more abundant. From the comprehensive energy management, the LED heat dissipation design idea makes a balance between the economic, reliability and effectiveness. Compound heat exchange pattern and unsteady heat transfer technology in the application of LED heat dissipation has the room for improvement.

关 键 词：大功率LED 强化散热 封装 热沉 能源综合管理 

分 类 号：TN312.8[电子电信—物理电子学]