溅射工艺参数对SiO_2/PET包装膜结合强度的影响  

Effect of Process Parameters on the Adhesion Strength of SiO_2 /PET Packaging Films by Magnetron Sputtering

作　　者：丁泽良[1] 孙敏[1] 王文韬[1] 

机构地区：[1]湖南工业大学机械工程学院,湖南株洲412007

出　　处：《包装学报》2013年第2期26-29,共4页Packaging Journal

基　　金：湖南省产学研结合专项计划基金资助项目(2010XK6065)

摘　　要：采用磁控溅射工艺制备了SiO2/PET包装膜,研究了射频功率、溅射时间、本底真空度和氩气流量等工艺参数对膜结合强度的影响。结果表明:随着射频功率、氩气流量的增大和溅射时间的增加,膜的结合强度均呈现出先增大后减小的变化趋势;本底真空度越高,薄膜的结合强度越大;所设的4个工艺参数中,溅射时间对薄膜结合强度的影响最大,射频功率次之,本底真空度和氩气流量的影响最小。SiO2/PET packaging films were prepared by magnetron sputtering. The effects of sputtering power, sputtering time, vacuum degree, and argon flow on the adhesion strength of films were researched. Results showed that the adhesion strength increased with the rise of sputtering power, sputtering time and vacuum degree, and then showed a little downtrend. Among the four process parameters, the sputtering time exhibited the greatest impact on the adhesion strength, while vacuum degree and argon flow revealed the slightest influence on the adhesion strength, and the influence of the sputtering power appeared intermediate.

关 键 词：磁控溅射 PET SIO2薄膜 工艺参数 结合强度 

分 类 号：TB487[一般工业技术—包装工程] O612.5[理学—无机化学]