分立IGBT的封装技术研究  

Study on the Discrete IGBT’s Assembly Crafts Technology

作　　者：刘驯[1] 姚小铭 

机构地区：[1]华汕电子器件有限公司,广东汕头515041

出　　处：《电子与封装》2013年第4期9-13,21,共6页Electronics & Packaging

摘　　要：文章通过对单器件的分立IGBT的封装结构进行分析,针对其结构特点和封装技术要求,特别是封装关键工艺芯片切割的影响,对装片、焊接方面进行工艺研究。并通过试验分析解决实际生产所出现的技术问题,由此形成一套适应于大批量封装生产的IGBT封装工艺技术,成功地应用于分立IGBT器件的批量生产,保证了产品的可靠性,取得了很好的生产效益。This document analyzes the discrete IGBT package structure, technical study in key assembly processes such as chip cutting, die attach, wire bonding, according as its structural characteristics and assembly technology requirements. And by experiment analysis to solve the technical problems in actual production, thus forming the discrete IGBT assembly technology adapted to the mass production. This technology is successfully used in mass production of discrete IGBT devices to ensure the reliability of the products, and obtain the good production efficiency.

关 键 词：IGBT封装 装片焊料 焊接参数 

分 类 号：TN305.94[电子电信—物理电子学]