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机构地区:[1]Advanced Electronic Materials Institute,General Research Institute for Nonferrous Metals [2]National Engineering Research Center for Semiconductor Materials,General Research Institute for Nonferrous Metals
出 处:《Journal of Rare Earths》2013年第4期395-399,共5页稀土学报(英文版)
基 金:supported by National Natural Science Foundation of China (50932001);National Natural Science Foundation of China (51102020,51202013);National Science and Technology Major Project(2009ZX02039-005)
摘 要:Effects of NH3 rapid thermal annealing (RTA) on the interface and electrical properties of Gd-doped HfO2 (GDH)/Si stack were investigated. The process of NH3 annealing could significantly affect the crystallization, stoichiometric properties of GDH film and the interface characteristic of GDH/Si system. NH3 annealing also led to the decrease of interface layer thickness. The leakage current density of Pt/GDH/p-Si MOS capacitor without RTA was 2× 10-3 A/cm2. After NH3 annealing, the leakage current density was about one order of magnitude lower (3.9× 104 A/cm2). The effective permittivity extracted from the C-V curves was -14.1 and 13.1 for samples without and with RTA, respectively.Effects of NH3 rapid thermal annealing (RTA) on the interface and electrical properties of Gd-doped HfO2 (GDH)/Si stack were investigated. The process of NH3 annealing could significantly affect the crystallization, stoichiometric properties of GDH film and the interface characteristic of GDH/Si system. NH3 annealing also led to the decrease of interface layer thickness. The leakage current density of Pt/GDH/p-Si MOS capacitor without RTA was 2× 10-3 A/cm2. After NH3 annealing, the leakage current density was about one order of magnitude lower (3.9× 104 A/cm2). The effective permittivity extracted from the C-V curves was -14.1 and 13.1 for samples without and with RTA, respectively.
关 键 词:Gd-doped HfO2 HIGH-K NH3 annealing INTERFACE electrical properties rare earths
分 类 号:TG156.2[金属学及工艺—热处理]
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