N-甲基硫脲对硫酸盐镀铜的影响  

Effects of N-Methylthiourea on Sulfate Copper Electroplating

作　　者：林航[1] 余小宝[1] 李巧云[1] 刘深娜[1] 杨阳[1] 林珩[1] 陈国良[1] 

机构地区：[1]漳州师范学院化学与环境科学系,福建漳州363000

出　　处：《漳州师范学院学报（自然科学版）》2013年第1期82-86,共5页Journal of ZhangZhou Teachers College（Natural Science)

基　　金：福建省科技厅高校产学研重大项目(2010H6029);福建省教育厅科技项目(JA10208)

摘　　要：采用电化学循环伏安法(CV)和电化学石英晶体微天平(EQCM)方法研究了添加剂N-甲基硫脲(MTU)对铜阳极溶出和阴极沉积过程的影响;通过塔菲尔方程研究了N-甲基硫脲和Cl-共同存在时对镀层耐腐蚀性的影响.结果表明:N-甲基硫脲改变了其反应历程,生成Cu(Ⅰ)的中间产物;当Cl-浓度为70mg/L时,镀层的耐腐蚀性最好.The influence of N-Methylthiourea （MTU）on the anodic dissolution and cathodic deposition of Cu in acid sulphate plating bath was studied by cyclic voltammetry and electrochemical quartz crystal microbalance（EQCM）. The effect of coexisted MTU and CI＂ on the corrosion resistance of copper deposition was investigated by Tafel equation. The results showed that N-Methylthiourea can change the mechanism of the anodic dissolution and cathodic deposition, produce the Cu＋ ions. When Cl- is 70mg/L, the corrosion resistance of copper deposition is the best.

关 键 词：L:酸性镀铜 N-甲基硫脲 塔菲尔曲线 EQCM 铜 

分 类 号：O646[理学—物理化学]