退火温度对PtCu双金属催化剂结构及析氢活性的影响  

Influence of Annealing Temperature on Structure and Hydrogen Evolution Activity of PtCu Catalyst

作　　者：莘明哲[1] 杨滨[1] 黄能[1] 

机构地区：[1]昆明理工大学材料科学与工程学院,云南昆明650093

出　　处：《热加工工艺》2013年第8期167-170,共4页Hot Working Technology

基　　金：云南省应用基础研究基金资助项目(2008ZC007M);昆明理工大学分析测试基金资助项目(2011072;2011071)

摘　　要：通过离子束溅射辅助沉积技术(IBSAD)制备了掺杂Cu元素的Pt基催化膜电极,并对电极进行了退火处理。利用EDS及XRD检测了电极的成分及结构,通过循环伏安法测试电极的析氢活性。结果表明:掺杂Cu的膜电极中形成了PtCu合金固溶体,且参与合金化的程度随退火温度而变化,显示退火温度是影响PtCu金属合金化的关键因素;经400℃退火的试样电极的交换电流密度较原样提升约11.6%,析氢峰电位降低,说明金属Cu参与到Pt基催化剂的合金化过程能有效提高催化性能。It membrane electrodes with the dopped Cu were prepared by ion beam sputtering assisted deposition （IBSAD） techniques, and the membrane electrodes were annealed. The structure and composition of the membrane electrodes were configurated by EDS and XRD. Activity of hydrogen evolution in electrode was tested by cyclic voltammetry. The results show that the doped Cu with It in the membrane electrodes formes ItCu alloys, while the alloying extent is enhanced with the change of annealing temperature, and exchange current density of the sample annealed in 400℃ is improved about 11.6% to the original sample, that declare the alloying process of Pt-Cu can enhance the catalytic performance.

关 键 词：离子束溅射 PtCu合金催化电极 退火处理 析氢活性 

分 类 号：TG156.2[金属学及工艺—热处理]