钠钙玻璃微流管道的厚胶湿法腐蚀工艺优化  

Optimization of Wet Etching of Thick Photoresist for Micro-Flow Pipeline on Soda-Lime Glass

作　　者：李其昌[1] 王广龙[1] 王竹林[1] 张姗姗 高敏[1] 高凤岐[1] 

机构地区：[1]军械工程学院导弹工程系,石家庄050003 [2]上海市计量测试研究院在线通用所,上海200233

出　　处：《微电子学》2013年第2期282-286,共5页Microelectronics

摘　　要：为了克服石英玻璃和Pyrex 7740玻璃制作微流管道价格昂贵、工艺流程复杂等缺点,利用普通钠钙玻璃为基质、正光刻胶AZ4620为掩膜牺牲层,提出了一种高效、快速、低成本的微流管道制作方法。该方法优化了腐蚀工艺的关键参数,解决了光刻胶与玻璃的粘附性、光刻胶在腐蚀液中的耐受时间等问题。试验腐蚀深度达到80μm,最小特征尺寸小于50μm,微流管道侧壁陡直度小于100°,底部平整度误差小于±1.5μm,制作周期仅需4h左右。To overcome the disadvantages of high cost and complicated manufacturing process of micro-flow pipeline based on quartz glass or Pyrex 7740 glass,an efficient,rapid and low-cost micro-flow pipeline process was presented by using soda-lime glass as substrate carrier and positive photoresist AZ 4620 as sacrificial layer.In this technology,key parameters of etching process were optimized,and problems associated with adhesion of photoresist to glass and tolerance time of photoresist in etching solution were solved.With the optimized process,an etching depth of 80 μm,a minimum feature size less than 50 μm,a sidewall steepness less than 100°,and a bottom flatness error less than ± 1.5 μm were achieved,and the process cycle was only about 4 hours.

关 键 词：微细加工 钠钙玻璃 微流管道 紫外厚胶光刻 湿法腐蚀 

分 类 号：TN305.7[电子电信—物理电子学]