集成电路业温室气体排放变化之因素分解分析  

A Factor Decomposition Analysis on the Changes in Greenhouse Gas Emissions in Integrated Circuit Industry

作　　者：李劲[1] 王华[2] 

机构地区：[1]昆明理工大学质量发展研究院,昆明650093 [2]昆明理工大学研究生院,昆明650093

出　　处：《上海环境科学》2013年第2期57-62,共6页Shanghai Environmental Sciences

基　　金：国家自然科学基金(编号:50906035);云南省自然科学基金(编号:2009ZC012X);昆明理工大学人才培养基金项目(编号:14118310)资助

摘　　要：分析了我国集成电路产业的能源消耗及温室气体排放源，并以因素分解方法研究影响集成电路产业PFC8及CO2排放的关键因素。研究表明，2005—2010年集成电路产业能源消耗以电力为主，所产生的间接CO2排放量逐年递增。约占该产业全部温室气体（cO2当量）总量的70％75％，主要增量因素是结构比例，即集成电路产业的规模持续扩大带来的增量效应，而能耗强度为主要的减量因素，表明该产业改善了能源使用效益。由PFCs余量衍生的直接CO2当量分析结果表明，主要的增量因素仍为结构比例，而主要的减量因素为CO2产能消耗，表明该产业在技术改进和PFCs的选择与使用量方面，也达到减量效益。By applying the decomposition method, energy consumption and sources of greenhouse gas emissions in the integrated circuit industry in China were studied to identify key factors affecting perfluoro-carbons （PFCs） and carbon dioxide emissions. Results indicated that major form of energy use in the integrated circuit industry in the period of 2005-2010 was electricity, and its indirect carbon dioxide emissions were increasing year by year to account for 70% ~ 75% of all greenhouse gas emissions （carbon dioxide equivalent） in the industry. The structure mix in the industrial scale continuous expanding was a main factor to cause the increase in carbon dioxide emissions, whilst the improvement on its energy consumption efficiency was the main reduction factor. The analysis on the direct carbon dioxide equ incremental factor was still the structure mix, whilst CO2 valent derived from the PFCs margin showed that the capacity consumption was the main reduction factors. It revealed that the selection and usage of PFCs as well as technical improvement have also achieved the benefit of emission cuts in the integrated circuit industry.

关 键 词：集成电路产业 能源消耗 二氧化碳 全氟化碳 因素分解 

分 类 号：X16[环境科学与工程—环境科学]