甲基磺酸体系电镀锡及锡合金研究现状  

Present Research Situation on Methylsulfonate Tin and Tin Alloy Plating

作　　者：张著[1] 吴海国[1] 宾智勇[1] 李婕[1] 

机构地区：[1]湖南有色金属研究院,湖南长沙410100

出　　处：《湖南有色金属》2013年第2期36-39,76,共5页Hunan Nonferrous Metals

摘　　要：对比了几种电镀锡体系的优缺点,介绍了甲基磺酸(MSA)体系电镀的镀液及镀层的特点,分析了甲基磺酸体系镀液稳定的原因。展望了甲基磺酸盐镀锡的发展前景。The advantages and disadvantages of the system of several tinelectroplating were compared, the characteris- tics of methylsulfonate（MSA） plating bath and plating were introduced, and the reason of methylsulfonate plating bath stability was analyzed. The developing foreground of methylsulfonate tin and tin alloys plating was prospected.

关 键 词：甲基磺酸 电镀锡 可焊性镀层 环保 

分 类 号：TF111.5[冶金工程—冶金物理化学]