温度循环试验参数的比较与选择  

The Comparison and Selection of the Temperature Cycling Test Parameters

作　　者：黄蓉[1] 文昌俊[1] 聂磊[1] 余军星[1] 

机构地区：[1]湖北工业大学机械工程学院,湖北武汉430068

出　　处：《湖北工业大学学报》2013年第2期62-65,共4页Journal of Hubei University of Technology

摘　　要：温度是影响电子产品可靠性的重要环境因素.温度循环试验是环境试验中最常用、最有效的试验之一,对评价产品的可靠性和进行质量监控有着重大意义.通过对温度循环试验的温度范围、暴露时间、转换时间、温度变化速率、循环次数等关键参数进行分析,比较了试验标准MIL-STD-883G、JEDEC、GB/T2423中温度循环试验关键参数的差异,针对不同产品的具体要求,提出了选择适当标准的依据.The temperature is an important environmental factor which affects the reliability of electronic products and temperature cycling is one of the most commonly used and effective methods in environment testing. Thus temperature cycling test has great significance in reliability evaluation and quality control. In this paper, the key parameters of the temperature cycling test, such as maximum or minimum sample temperature, dwell time, load transfer time, ramp rate, and cycle number were analyzed to compare the differences of those widely used test standards which include MIL STD 883G,JEDEC, and the GB/T2423. The specific requirements of different products were also discussed. Based on the analysis and discussion, the theoretical basis of chno,~in~ ~ .a~_a

关 键 词：可靠性 试验标准 关键参数 温度循环 

分 类 号：TN406[电子电信—微电子学与固体电子学]