双金属材料复合圆板Ⅲ型界面裂纹扩展的研究  

Research on Mode Ⅲ Interface Crack Propagation in Bimaterial Disc

作　　者：金誉辉 金长义[2] 陈金梅[2] 张晓斌 

机构地区：[1]广西特种设备监督检验院,广西南宁530219 [2]广西工业职业技术学院,广西南宁530003

出　　处：《化工技术与开发》2013年第5期41-44,共4页Technology & Development of Chemical Industry

摘　　要：采用分离变量的方法求解了双金属材料复合圆板Ⅲ型界面裂纹动态扩展问题,得到了裂纹尖端的应力、位移场的理论解表达式,并通过典型算例,研究了裂纹区应力、位移及应力强度因子等关系,为认识双金属材料复合圆板Ⅲ型界面裂纹扩展机理提供理论依据。The mode m interface crack dynamic propagation under anti-plane shear, in a thin disc with homogenous and isotropic brittle materials, was studied. The theoretical expressions of the stress and displacement fields at the crack tip were analyzed by the separation of variables method. At the same time, the relationship among the stress, the displacement, and the stress intensity factor of the crack tip was analyzed by the typical example. Theoretical basis would be obtained by the comprehension of the mode IU in- terface crack dynamic propagation.

关 键 词：双金属材料 分离变量法 应力场 位移场 应力强度因子 

分 类 号：O346.11[理学—固体力学]