电镀工艺对铜锡合金镀层渗氢的影响  

Effect of Electroplating Parameters on Hydrogen Permeation of Electroplated Copper-Tin Coatings

作　　者：李福永 程相榜 于德润 

机构地区：[1]郑州煤矿机械集团股份有限公司,河南郑州450016

出　　处：《材料保护》2013年第5期36-38,1,共3页Materials Protection

摘　　要：为了减少铜锡合金电镀过程中的渗氢,在调质处理钢上直流电镀和脉冲电镀铜锡合金,采用Devanathan装置原位测氢,研究了2种电镀工艺及工艺参数对电镀铜锡合金过程中渗氢行为的影响。结果表明:直流电镀时,随着电流密度的增加,稳态渗氢电流密度和渗氢量增加;脉冲电镀工件表面可扩散氢浓度较低,渗氢量较小;脉冲频率和占空比对脉冲电镀铜锡合金中稳态渗氢电流密度和渗氢量影响显著,当平均电镀电流密度为5 A/dm2时,脉冲频率为1 500 Hz,占空比为35%时,稳态渗氢电流密度最小,约为1.5μA/cm2,渗氢量最小,约为2.9 mL,较直流电镀降低了72%。Direct current (DC) electroplating and pulse electroplating were separately adopted to prepare copper-tin coatings on the surface of thermally refined steel. A Devanathan device was performed to in-situ determine hydrogen during the electroplating of the copper-tin coatings,and the effects of electroplating parameters on the hydrogen permeation behavior of electroplating copper-tin coatings were investigated. Results indicated that the steady hydrogen permeation current density and hydrogen permeation volume increased with the increase of DC density. Besides,a small concentration of permeated hydrogen and a small hydrogen permeation volume were obtained for pulse electroplated steel; and pulse frequency and duty cycle had significant effects on the hydrogen permeation current density and hydrogen permeation volume. Particularly,under an average current density of 5 A/dm 2 ,a pulse frequency of 1 500 Hz and a duty cycle of 35%,pulse electroplated copper tin coating had the minimum steady-state hydrogen permeation current density of 1. 5 μA/cm 2 and the minimum hydrogen permeation volume of 2. 9 mL.

关 键 词：铜锡合金 脉冲电镀 直流电镀 渗氢量 稳态渗氢电流密度 脉冲频率 占空比 

分 类 号：TQ153.2[化学工程—电化学工业]