热处理对卤化银多晶光纤显微结构的影响  

Effect of Thermal Treatment on the Microstructure of Polycrystalline Silver Halide Fibers

作　　者：高建平[1] 卞蓓亚[1] 张议[1] 武忠仁[1] 

机构地区：[1]中国科学院上海硅酸盐研究所,上海200050

出　　处：《无机材料学报》2000年第5期787-790,共4页Journal of Inorganic Materials

基　　金：八六三计划新材料领域资助!(715-001-0211)

摘　　要：热挤压法成型的卤化银多晶光纤，经不同温度热处理后；光纤的显微结构发生了变化．扫描电镜形貌分析结果显示；热处理温度Ｔ≤１７０℃，显微结构未发生变化，晶粒尺寸１～２μｍ． Ｔ＝２００℃时，晶粒尺寸１０～２００μｍ； Ｔ＝２５０℃时，晶粒尺寸２０～３０μｍ ；Ｔ＝３００℃时，晶粒尺寸３０～４０μｍ．光纤显微硬度测量结果也显示，热处理温度＞１７０℃后，光纤的显微硬度随热处理温度的升高而降低，在２００℃附近硬度降至最低值．The silver halide fibers were made by hot extrusion. The microstructure of the fibers changed after thermal treatment at different temperatures. SEM micrographs showed that the microstructure of the fibers did not change when temperatures of thermal treatment T < 170℃, and their grain sizes were 1-2μm. The grain size grew up when T > 170℃. The relation of grain size and T was as follows: 10-20μm, T = 200℃; 20-30μm, T = 250℃; 30～40μm, T = 300℃, respectively. The measurements of microhardness also showed that the microhaxdness of the fibers decreased as temperatures of thermal treatment increased when T > 170℃ and the lowest microhardness appeared at 200℃.

关 键 词：红外光纤 卤化银 热处理 显微结构 

分 类 号：TN213.04[电子电信—物理电子学]