微量Te对Cu-30CrTe合金触头材料抗焊接性的影响  

Effects of Trace Te on Anti-welding Property of Cu-30CrTe Alloy Contact Material

作　　者：苗柏和[1,2] 谢景林[3] 何建平[1] 刘国勋[1] 王文斌 王小军 

机构地区：[1]北京科技大学,北京100083 [2]陕西斯瑞工业有限责任公司,西安710077 [3]北京大学化学与分子工程学院北京分子科学国家实验室,北京100871

出　　处：《电工材料》2013年第2期18-22,共5页Electrical Engineering Materials

摘　　要：使用光学显微镜和扫描电镜(SEM)观察熔铸Cu-30CrTe、Cu-30Cr和烧结粉末冶金CuCr25等三种触头材料经真空扩散焊后的室温拉伸断口及焊接结合区纵断面的显微组织。三种触头材料具有不同的断裂特征,熔铸Cu-30CrTe材料焊接结合面的显微组织明显不同于烧结CuCr25;同时参考X射线光电子能谱(XPS)表面分析结果,对添加微量Te改进触头材料抗焊接性的机理和评判原则进行了讨论。The tensile fracture at room temperature and the faying microstructures of vacuum casting Cu-30CrTe, Cu-30Cr and sintered CuCr25 contact materials after diffusion welding in vacuum were evaluated by optical microscope and SEM. It is found that there are different fracture characteristics in the materials and distinct microstructures formed at the laying surface of the Cu-30CrTe from that of the sintered CuCr25; meanwhile consulting the XPS surface analysis results of elemental content and valence state of trace Te in the Cu-30CrTe contact material, the mechanism and principles of trace Te improving the anti-welding property of the Cu-30CrTe alloy contact material are discussed.

关 键 词：CUCR触头材料 抗焊接性 焊接结合面 显微组织 断裂特性 X射线光电子能谱 

分 类 号：TM501.3[电气工程—电器] TG115.6[金属学及工艺—物理冶金]