含纳米铝颗粒SnAgCu钎料组织与性能  

Microstructure and properties of SnAgCu solders bearing Al nano-particles

作　　者：张亮 韩继光[1] 郭永环[1] 何成文[1] 张剑[1] 

机构地区：[1]江苏师范大学机电工程学院,徐州221116 [2]江苏科技大学先进焊接技术省级重点实验室,镇江212003

出　　处：《焊接学报》2013年第6期65-68,116,共4页Transactions of The China Welding Institution

基　　金：江苏省自然科学基金资助项目(BK201244);江苏省高校自然科学基金资助项目(12KJB460005);江苏科技大学先进焊接技术省级重点实验室开放研究基金资助项目(JSAWS-11-03);江苏师范大学自然科学研究基金资助项目(11XLR16)

摘　　要：选择在SnAgCu钎料中添加纳米铝颗粒,改善无铅钎料的性能.结果表明,微量纳米铝颗粒可以增加SnAgCu钎料的润湿铺展面积,显著提高SnAgCu焊点的拉伸力和剪切力,添加过量时钎料的润湿性能会有一定程度的下降,经过优化分析发现纳米铝颗粒的最佳添加量应该控制在0.1%附近.对SnAgCu-xAl钎料的组织分析,发现纳米颗粒的添加,钎料组织得到明显的细化,树枝晶间距明显减小.对SnAgCu-xAl焊点进行蠕变拉伸测试,发现纳米铝颗粒可以显著提高SnAgCu焊点的蠕变断裂寿命,主要归因于纳米颗粒对位错的钉扎作用.Al nano-particles were added into the SnAgCu solder to improve the properties.The results indicate that adding small amount of nano-particles can enhance the wettability of the SnAgCu solder,and the mechanical properties of the soldered joints can be improved significantly.However,excessive nano-particles would reduce the wettability of the solder,and the optimum nano-particles content was about 0.1wt% for the SnAgCu solder.Based on the microstructure examination,it was found that adding nano-particles could obviously refine the microstructure and reduce the dendrite-arm spacing of SnAgCu-xAl solders.In addition,the creep tensile test for the joint made with SnAgCu-xAl solder revealed that the nano-particles could significantly improve the creep rupture life by pinning the dislocations.

关 键 词：纳米颗粒 无铅钎料 力学性能 蠕变断裂寿命 

分 类 号：TG454[金属学及工艺—焊接]