磁控溅射镀膜的原理与故障分析  

The Principle and Fault Diagnosis of Magnetron Sputtering Deposition

作　　者：郝晓亮[1] 

机构地区：[1]中国电子科技集团公司第十三研究所,河北石家庄050051

出　　处：《电子工业专用设备》2013年第6期57-60,共4页Equipment for Electronic Products Manufacturing

摘　　要：介绍了磁控溅射镀膜的种类及特点。以直流磁控溅射为例,介绍了其结构、原理,分析了影响磁控溅射工艺稳定性的因素。最后总结了磁控溅射镀膜工艺中常见的故障以及解决方法。This paper introduces the type of Magnetron SputteringDeposition.The features of every types are analyzed.An example of Direct Current Magneton Sputtering Deposition is given to show the structure and principle of Magetron Sputtering.The factors that can affect the stability of Magnetron Sputtering process are qualitatively analyzed.Finally, the normal faults and solutions of Magnetron Sputtering process are summarized.

关 键 词：物理气象淀积 磁控溅射 故障分析 镀膜工艺 

分 类 号：TN305.92[电子电信—物理电子学]