印制电路板电磁兼容设计浅析  

The Research of EMC’s Design for PCB

作　　者：彭亮[1] 黄峥嵘[1] 黄明晖[1] 杜迎[1] 

机构地区：[1]中国电子科技集团公司第58研究所,江苏无锡214035

出　　处：《电子与封装》2013年第6期24-28,共5页Electronics & Packaging

摘　　要：文中介绍了印制电路板上电磁干扰辐射产生的主要原因,并对其产生的机理进行了详细的研究和分析,得出了能够减少电磁干扰的几种方法。在印刷电路板设计中,对单面板的线路板迹线的阻抗和PCB布线的分析以及对双层PCB板的设计分析,基本保证了印制电路板的质量与可靠性,并减小了电磁干扰的影响。最后,通过对地线网络、地线面、输入输出地的结构、地线布线规则等几种接地方式进行较为详细的研究与分析,得出了进一步减小电磁干扰的方法。The main reason that caused electromagnetic interaction （EMI） on PCB （Printed-Circuit-Board） was introduced in this paper. The principle of EMI was studied and some ways to decrease EMI were found. The PCB＇s quality and reliability were ensured basically and the affect of EMI to PCB was decreased by analyzing PCB＇s resistance, routing and design of single layer and double layer. Some ways, such as ground net, the construction of I/O ground, ground rule and etc, were studied so that the more methods to decrease EMI farther were gained.

关 键 词：电磁干扰 印制电路板 地线 布线 

分 类 号：TN406[电子电信—微电子学与固体电子学]