多层混压印制板中微波参考地的研究  

Study on Microwave Reference Ground in Multi-layer Hybrid Pressing PCB

作　　者：李兵[1] 李磊[1] 

机构地区：[1]西安电子工程研究所,西安710100

出　　处：《火控雷达技术》2013年第2期103-106,共4页Fire Control Radar Technology

摘　　要：本文简要论述了多层混压印制板工艺的实现方式,分析在微波电路中应用的优势和需要注意的问题,并着重对多层混压电路中微波参考地问题进行仿真和分析,提出两种有效地解决微波电路中参考地的共地方法,在经过实际验证后已经用于TR组件的集成设计。Implementing way of multilayer hybrid pressing PCB（ printed circuit board） technique is briefly depicted, and advantageous of applying this technique in microwave circuit and issues needed to be noted are analyzed ; the issue of microwave reference ground in muhilayer hybrid pressing PCB is simulated and analyzed; two kinds of co - ground method used to solve reference ground in microwave circuit effectively are presented, which are applied in integrated design of T/R module after being verified practically.

关 键 词：多层印制板 混压 参考地 

分 类 号：TN454[电子电信—微电子学与固体电子学]