碳化硅/环氧树脂复合材料的制备及性能研究  

Preparation and flexural performance of SiC /epoxy composites

作　　者：刘艺帆[1] 李景庆[2] 

机构地区：[1]北京航空航天大学生物与医学工程学院,北京100083 [2]天津大学材料科学与工程学院,天津300072

出　　处：《粘接》2013年第7期51-53,60,共4页Adhesion

摘　　要：分别采用固化剂D230、9035、acamine2636与环氧树脂E51混合,然后分别与用硅烷偶联剂(KH550、KH560、A171)处理的碳化硅颗粒混合,采用浇注法制备了碳化硅/环氧树脂复合材料。以材料的弯曲强度为评价方法,研究了3种不同固化剂构成的环氧树脂体系以及3种硅烷偶联剂对碳化硅/环氧树脂复合材料性能的影响,以及复合材料弯曲强度与材料中环氧树脂含量的关系。结果表明,3种固化剂中以D230、9035制备的材料性能为好;采用KH550、KH560处理碳化硅颗粒后的材料性能比不处理或采用A171处理碳化硅颗粒后的材料性能为好。随着复合材料中环氧树脂相含量的增加复合材料的弯曲强度下降。In this paper,the silicon carbide （SiC）/epoxy composites were prepared by mixing three different curing agents （D230,9（）35,ancamine 2636） respectively with epoxy resin （E51）,then filrther with the untreated or silane coupling agent （KH550,KH560,A171 respectively） treated SiC particles,and finally casting and cnring.The flexural strength of composites was used to evaluate the effects of curing agent,coupling agent and binder content on the performance of SiC/epoxy composites.The results showed that the flexural strength ofSiC/epoxy composites cured with D230 or 9035 was better than that of those cured with acamine 2636;the flexural strength of SiC/epoxy composites from the SiC particles treated with KH550 or KH560 was better than that of those from the particls treated with A171 or pure SiC particles;the flexuralstrength of SiC/epoxy composites decreased as the epoxy binder content increased.

关 键 词：环氧树脂 碳化硅 复合材料 

分 类 号：TQ433.437[化学工程]