晶圆预对准系统建模及仿真  

Modeling and Simulation of Wafer Pre-Alignment System

作　　者：孙义田[1] 李学威[1] 张一博[1] 何书龙[1] 张鹏[2] 

机构地区：[1]沈阳新松机器人自动化股份有限公司,辽宁沈阳110168 [2]东北大学机械工程与自动化学院,辽宁沈阳110819

出　　处：《机械设计与制造》2013年第3期184-187,共4页Machinery Design & Manufacture

基　　金：国家科技重大专项-IC装备机械手及硅片传输系统系列产品研发与产业化(2009ZX02012)

摘　　要：为了对晶圆预对准过程进行建模及仿真,建立了晶圆边缘数据采集模型,其重点在于缺口模型的建立。首先采用分段函数法对晶圆边缘曲线进行建模,再根据几何关系分段建立晶圆边缘数据采集模型。最后,根据所采集到的晶圆边缘的数据分别采用不同算法计算出晶圆的偏心及缺口的方向。该模型不但建立了包括缺口在内的完整晶圆边缘模型,而且还考虑了转动中心偏置及CCD分辨率等的影响,利用此模型可以系统的对晶圆预对准过程进行深入的研究。In order to carry out the modeling and simulation of wafer pre-alignment progress,wafer edge data acquisition model is established,and the key point of which is notch modeling.First the model of wafer edge curve is established using piecewise function and then wafer edge data acquisition model of each segment is established.Finally,wafer eccentricity and notch direction using different algorithms is calculated based on the collected data of wafer edge.Not only is complete wafer edge model established,but also is the impact of rotation center offset and CCD resolution took into account.With this model,it can be done with further study on wafer pre-alignment progress systematically.

关 键 词：晶圆预对准 偏心 缺口 建模仿真 

分 类 号：TH16[机械工程—机械制造及自动化] TP242.202[自动化与计算机技术—检测技术与自动化装置]