PECVD装置的有限元分析及结构优化  

Finite Element Analysis and Structural Optimization of PECVD Device

作　　者：吴晓松[1] 褚学宁[1] 

机构地区：[1]上海交通大学机械与动力工程学院,上海200240

出　　处：《机械设计与制造》2013年第7期1-3,共3页Machinery Design & Manufacture

摘　　要：针对PECVD装置在真空高温工作环境下存在的热变形问题,运用有限元流—热—结构耦合分析方法,对装置结构进行流固耦合传热特性分析,得出装置的稳态温度场分布情况,将分析结果作为装置流—热—结构耦合分析的边界条件加载到装置结构上,求得装置在热载荷和结构载荷综合作用下的变形情况。基于原有装置结构的分析结果,分析装置变形的主要原因,提出可行的优化改进方法。有限元分析结果表明,装置变形是热载荷和结构载荷综合作用的结果,其中热载荷为装置变形的主要因素;减小热载荷是控制装置变形,保证装置正常工作及可靠性的一个非常重要的因素。In view of thermal deformation of PECVD device in the vacuum and high temperature conditions,it carries on fluid-thermal-structural coupling analysis,studies fluid-structural coupling heat transfer characteristics,derives the steadystate temperature distribution of the device,and then takes the results of the analysis as boundary conditions of the fluid thermal-structural coupling analysis,and obtains the deformation under the joint action of thermal-mechanical load.Based on the analysis of the original device,it analyzes the main reasons of the deformation,proposes feasible optimized method.The results of the finite element analysis show that the deformation of the device is the comprehensive function of the thermal load and structural load while the former is the main factor;and it is a key factor to control device deformation and ensure the device working properly and reliability by reducing the thermal load.

关 键 词：PECVD装置 热变形 流—热—结构耦合分析 有限元 结构优化 

分 类 号：TH16[机械工程—机械制造及自动化] TB115[理学—数学]