BGA焊点形态和布局对信号完整性的影响  

Influence of shape and distribution of BGA solder joints on signal integrity

作　　者：石光耀[1] 尚玉玲[1] 曲理[1] 

机构地区：[1]桂林电子科技大学电子工程与自动化学院,广西桂林541004

出　　处：《桂林电子科技大学学报》2013年第4期279-283,共5页Journal of Guilin University of Electronic Technology

基　　金：国家自然科学基金(61102012);广西教育厅科研项目(201103YB054)

摘　　要：为了研究BGA焊点形态和布局对反射和串扰的影响,基于三维全波电磁仿真软件HFSS,建立了BGA焊点的三维模型,研究BGA焊点的形态(高度、最大外径和焊点端口直径)以及布局对反射和串扰的影响。结果表明,随信号频率、焊点高度、焊点最大外径和焊点端口直径的增大,回波损耗增大;焊点的形态对相邻焊点串扰影响不明显;焊点串扰噪声受相邻焊点影响最大,对角线焊点次之。In order to study the effect of BGA solder joint shape and layout on signal integrity.BGA solder joints 3D model is established,the influence of the shape（height,diameter and port diameter） and distribution of BGA solder joints on signal integrity base on HFSS is researched.The result shows that RL increases with the rise in the frequency,the solder joint height,the maximum diameter and the port diameter.There are fewer effects on the adjacent solder joint crosstalk by the shape of solder joint.The solder joint crosstalk noise is influenced largely by the adjacent solder joints and the effect of the diagonal solder joints is minor.

关 键 词：BGA焊点 信号完整性 回波损耗 串扰噪声 

分 类 号：TN47[电子电信—微电子学与固体电子学]