LTCC材料介电性能的影响研究  

Influence Factor of Dielectric Properties of LTCC Materials

作　　者：程书博[1] 

机构地区：[1]中国电子科技集团公司第13研究所,石家庄050051

出　　处：《电子与封装》2013年第7期5-7,16,共4页Electronics & Packaging

摘　　要：文章研究了La2O3-B2O3和SiO2作为添加剂对钙硼硅系LTCC材料的烧结和介电性能的影响。实验结果表明,La2O3-B2O3添加剂促进了CaSiO3的析晶,从而极大增强了钙硼硅玻璃陶瓷的抗弯强度。Si用于调节样品的收缩率以满足实际生产要求。CaO-B2O3-SiO2-6wt%La2O3-B2O3-7wt%Si样品性能较好:εr=6.13,tanδ=12.34×10-4(10 GHz),弯曲强度σf≥160 MPa,收缩率为14.9%。The effect of La2O3-B2O3 and SiO2 adding on the sintering property and dielectric properties of CBS glass ceramic were researched.Results showed that the crystallization of CaSiO3 was improved by the addition of La2O3-B2O3 and it could improved the bending strength of CBS glass ceramic.Si was used to adjust the shrinking rate of ceramic for satisfying the requirement of production.The properties of CaOB2O3-SiO2-6wt% La2O3-B2O3-7wt%Si were excellent.The dielectric constant（εr）was 6.13,dielectric loss（tanδ）was 12.34×10-4（10 GHz）,bending strength was more than 160 MPa,shrinking rate was 14.9%。

关 键 词：LTCC玻璃陶瓷 CaO-B2O3-SiO2系 弯曲强度 介电性能 

分 类 号：TN304[电子电信—物理电子学]