TOSA外壳的烧结模具设计  

Design of Sintering Moulds for TOSA Package

作　　者：李凯亮[1] 杨鹏飞[1] 张庆[1] 

机构地区：[1]中国电子科技集团公司第43研究所,合肥230088

出　　处：《混合微电子技术》2013年第1期38-41,共4页Hybrid Microelectronics Technology

摘　　要：TOSA是光发射次模块（Transmitter Optical Subassembly）的缩写，属于光传输模块的一种。本文针对正在开发的某型TOSA外壳，分析此种外壳烧结模具设计的重点、难点问题及解决方法，同时结合批生产要求，设计出整体性强的阵列模具，该成果已成功应用于TOSA外壳的研制生产。TOSA is the abbreviation of transmitter optical sub - assembly,it is a kind of the optical transmission module. According to the developed package of TOSA, the key and difficult problems and solutions of sintering mould design are analyzed, combined with the requirements of mass production, good integrity array mould is designed, and the results have been successfully used in the development and production of the TOSA packaging case.

关 键 词：TOSA 光传输模块 烧结模具 阵列模具 

分 类 号：TG76[金属学及工艺—刀具与模具]