腈纶纤维表面化学镀铜的研究  

Electroless Deposition of Copper on Surface of Acrylic Fibers

作　　者：尚世智[1] 谢薇[1] 李云[1] 

机构地区：[1]沈阳化工大学,辽宁沈阳110142

出　　处：《辽宁化工》2013年第8期897-900,共4页Liaoning Chemical Industry

摘　　要：研究以甲醛为还原剂对腈纶纤维表面进行化学镀铜,考察了温度、pH值、添加剂和纤维装载量对增重率和电阻的影响。确定了最佳化学镀铜条件:亚铁氰化钾为80 mg/L,2-2'-联吡啶为10mg/L,pH值为12.75,镀液温度为45℃,腈纶纤维为7.5 g/L。同时研究了微量添加剂亚铁氰化钾和2-2'-联吡啶以及复合光亮剂的加入对化学镀铜沉积速率和铜镀层质量的影响。实验结果表明,微量添加剂和复合光亮剂不仅对铜镀层的表面形貌和结构有很大的改善,而且可以降低铜镀层表面电阻率。由XRD、SEM可知:腈纶纤维镀层上的成分基本为纯铜,而且结晶度较高,微量添加剂和复合光亮剂的加入可使腈纶纤维镀层表面平整、光滑、晶粒细致,提高了纤维的电导率。Electroless deposition of copper on surface of acrylic fibers by using formaldehyde as reducing agent was studied;the influence of temperature,pH value,additives and fiber loading quantity on weight increasing rate and the resistance was investigated.the best chemical Cu-plating conditions were determined as follows： potassium ferrocyanide 80 mg/L,2-2 ＇-pyridine 10 mg/L,pH 12.75,the temperature 45 ℃,time 20 min,acrylic fibers 7.5 g/L.And the influence of adding trace potassium ferrocyanide,2-2 ＇-pyridine and composite brightener on chemical copper deposition rate and the quality of copper planting was studied.The experimental results show that adding trace additives and composite brightener not only can greatly improve the copper plating surface morphology and structure,but also can reduce copper plating surface resistivity.XRD and SEM images demonstrate that the surface of copper film is smooth and fine.

关 键 词：腈纶导电纤维 化学镀铜 微量添加剂 复合光亮剂 

分 类 号：TQ153.3[化学工程—电化学工业]