新型耐热环氧单体的合成及性质研究  

Investigation on the Synthesis and Properties of Novel Heat-resistant Epoxy Monomer

作　　者：林尤谊[1,2] 龚福春[1] 孙蓉[2] 张国平[2] 

机构地区：[1]长沙理工大学化学与生物工程学院,湖南长沙410000 [2]中国科学院深圳先进技术研究院集成所先进材料中心,广东深圳518000

出　　处：《合成材料老化与应用》2013年第4期1-5,共5页Synthetic Materials Aging and Application

基　　金：国家自然科学基金(21201175);广东省引进创新科研团队计划资助(2011D052);深圳市战略性新兴产业发展专项资金(JCYJ20120615140007998)

摘　　要：报道了一种含萘芳香酯型环氧单体二(4-(2,3-环氧丙氧基)苯甲酸)-2,7-萘-4,4-二酯(P4)的合成及性质研究。利用FT-IR、1H NMR、质谱等分析测试方法对P4目标化合物的结构进行了表征。并用4,4-二氨基二苯基砜(DDS)和4,4-二氨基二苯基甲烷(DDM)两种芳香二胺固化剂对P4进行非等温固化研究。由结果可知,DDM/P4的固化峰温度为140℃,DDS/P4的固化峰温度为210℃,DDM能显著降低P4的固化温度。最后,通过对P4/DDM和环氧E20/DDM这两种固化物的热失重研究表明P4/DDM固化物具有较高的热稳定性。The synthesis and properties of a novel epoxy mornor naphthalene-4,4＇-diylbis（4-（ oxiran-2-ylme- thoxy） benzoate） were reported by this work. The molecular structure were characterized by Fr-IR, 1H NMR, and mass spectra. Two curing agents,4,4-diaminodiphenylsulfon （DDS） and 4,4-Diaminodiphenyl methane （ DDM ）, were chosen to investigate the curing behavior of P4/aromatic diamine by means of nonisothermal DSC. It can be seen from results that the curing peak temperature of P4/DDM is 140℃ and that of P4/DDS is 210℃. Comparing with DDS, DDM can decrease the curing temperature of P4. At last, the thermogravimetry analysis of P4/DDM com- posites and E20/DDM composites were also investigated. The results showed that the P4/DDM composites presented higher thermal stability.

关 键 词：萘 环氧单体 合成 固化 

分 类 号：O631[理学—高分子化学]