一种MLCC焊接失效分析  

One failure analysis of welding on end electrode in multilayer ceramic capacitors

作　　者：桂龙[1] 包生祥[1] 饶真真[1] 张诚实[1] 

机构地区：[1]电子科技大学电子薄膜与集成器件国家重点实验室,四川成都610054

出　　处：《电子元件与材料》2013年第9期56-58,共3页Electronic Components And Materials

基　　金：总装备部军用电子元器件支撑与共性课题

摘　　要：为找出某厂生产的多层陶瓷电容器端电极存在焊接失效的原因,运用体视显微镜、扫描电子显微镜和能谱仪对问题批次样品的端电极进行分析。从分析结果可知,在多层陶瓷电容器Cu端电极烧结过程中,Cu端表面有玻璃相溢出,这导致端电极部分区域的Ni层和Sn层电镀异常,最终造成电容器的焊接失效。经过对玻璃相溢出原理的分析,提出可以从铜浆料选择、烧结温度和封端工艺方面来解决该问题。Aimed at the welding failure problem on end electrode in multilayer ceramic capacitors （MLCC）, the end electrodes of failed samples were analyzed by stereo microscope, scanning electron microscope （SEM） and energy disperse spectroscopy （EDS）. The analysis results show that glass phase overflows from the surface of Cu end electrode in the process of Cu end electrode sintering, which leads to abnormality of tin and nickel plating in some end electrode area and gives rise to final welding failure. Through analysis of the principle of glass phase overflowing, selecting appropriate copper paste, sintering temperature and sealing process are recommended to solve this welding failure problem in MLCC devices.

关 键 词：多层陶瓷电容器 端电极 焊接失效 玻璃相 电镀 烧结温度 

分 类 号：TN432[电子电信—微电子学与固体电子学]