Cu厚膜微带制作及其性能研究  

Development of copper thick film microstrip

作　　者：戴宴平 侯国栋 

机构地区：[1]机电部第十研究所 [2]所电部第十研究所

出　　处：《电讯技术》1991年第4期12-18,共7页Telecommunication Engineering

摘　　要：本文进一步研究了新型的在大气气氛中烧结的贱金属(Cu)多层导电浆料,并采用干膜反光刻抛光微带工艺,将浆料推广应用到较高频率范围的微波集成电路。文中介绍了制作低通滤波器和混频器的实例。This paper introduces a new base metal Cu multilayer conductor paste firingin the air. The behavious of the paste is raised largely by means of reducing copperpowder diameter and improving firing technology. We have used a dry film reversephotoetching polish technology, and thus Cu multilayer conductor paste can be appliedto higher frequency microwave integrated circuit. praetical examples making low passfilter and mixer are given in the paper.

关 键 词：微波集成电路 厚膜 微带 铜 制作 

分 类 号：TN454.05[电子电信—微电子学与固体电子学]