导电胶用纳米石墨微片的表面化学镀Cu及其表征  

Electroless Cu plating and characterization of graphite nanosheet surface for conductive adhesive

作　　者：杨莎[1] 齐暑华[1] 程博[1] 马莉娜[1] 

机构地区：[1]西北工业大学理学院应用化学系,陕西西安710129

出　　处：《中国胶粘剂》2013年第8期5-9,共5页China Adhesives

基　　金：西北工业大学研究生创业种子基金资助项目(Z2013152)

摘　　要：采用无钯化学镀Cu法对纳米石墨微片表面进行处理,并对其制备工艺进行了探究,旨在得到一种导电胶用新型导电填料。研究结果表明:当改性剂浓度为3 g/L、AgNO3浓度为3 g/L、氨水浓度为40 g/L、m(无水乙醇)∶m(水)=9∶1、活化温度为50℃和活化时间为1.5 h时,纳米石墨微片表面镀上了一层致密而均匀的金属Cu层,Cu层的厚度约为100 nm,Cu沉积量超过60%(相对于纳米石墨微片质量而言)。In order to get a new type of conductive filler for conductive adhesive,the graphite nanosheets surfaces were treated by electroless Cu plating without Pd method,and its preparation process was explored. The research resuhs showed that the graphite nanosheets surfaces were coated by a dense and uniform Cu layer,which thickness was about 100 nm,and the Cu mass depositions were more than 60% in graphite nanosheets when the concentrations of modifier, AgNO3 and ammonia were 3,3,40 g/L respectively,mass fraction of m （ethanol without wat er）：m （water） was 9：1, aetivation temperature and time were 50℃ and 1.5 h respectively.

关 键 词：无钯化学镀Cu法 纳米石墨微片 导电胶 镀Cu纳米石墨微片 

分 类 号：TQ437.6[化学工程]