功率型LED封装材料的研究进展  

Progress in the Research of Packaging Materials of Power LED

作　　者：朱祖钊[1,2] 殷磊 陈长科 林益军 全春生 陈旭东[2] 

机构地区：[1]长沙蓝星化工新材料有限公司,湖南长沙410117 [2]中山大学化学与化学工程学院,广东广州510275

出　　处：《广州化工》2013年第16期54-55,60,共3页GuangZhou Chemical Industry

摘　　要：指出了环氧树脂作为目前LED主流的封装材料性能的不足,分析了目前改性环氧树脂、有机硅改性环氧树脂、有机硅树脂等做为功率型LED封装材料的优点和局限。综述了国内外主流的环氧树脂、有机硅改性环氧树脂、有机硅树脂等封装材料的研究进展。展望了功率型LED封装材料的发展趋势。The deficiencies of epoxy resin performance,as the current mainstream packaging material of LED,were pointed out,and advantages and disadvantages of modified epoxy resin,silicone-modified epoxy resin,and silicone resin as the packaging material of power LED were analyzed.The research developments of the materials were reviewed.The development trend of the packaging material of power LED was also presented.

关 键 词：LED 封装材料 有机硅 环氧树脂 有机硅改性环氧树脂 

分 类 号：TQ638[化学工程—精细化工]