基于君正4770处理器主控模块MCM组件的设计与分析  

Design and Analysis of the MCM Main Control Module Based on the JUNZHENG JZ4770 Processor

作　　者：郭文斌[1] 刘晓超 刘学[1] 马幼鸣[1] 

机构地区：[1]北京理工大学信息与电子学院

出　　处：《电子技术（上海）》2013年第8期67-69,66,共4页Electronic Technology

摘　　要：多芯片封装组件MCM由于其高度集成性使得近年来在电子设备整机高速化、多功能化和小型化发展中得到了广泛应用,但MCM因工作生热导致的内部热应力及应力集中问题已经成为影响电路可靠性的关键因素。通过实验方法只能获得MCM封装实体外部的温度,而内部的温度场和应力应变情况只能通过计算机仿真技术来得到。文章利用有限元分析软件ANSYS对基于君正4770处理器的主控模块MCM组件设计进行了温度场和热应力应变分析,并且通过优化设计提高了组件设计的可靠性。Since its high integration, MCM （Multi-chip Module） is recently widely used in the development of electronic equipment which requires high speed performance, multifunction and small size. However, the internal thermal stress and stress concentration have become key factors that affect on reliability of the circuits. Experimental methods can only obtain external thermal information of the MCM, and the data of internal thermal field, stress and strain only can be obtained through computer simulation. In this paper, we use the ANSYS software to analyze the thermal field and thermal stress and strain of the MCM main control module that based on the processor of JZ4770 from JUNZHENG, and then improve the reliability of this design by optimization.

关 键 词：多芯片组件 有限元 热分析 温度场 

分 类 号：TP311.1[自动化与计算机技术—计算机软件与理论]