半导体封装测试生产线CONWIP建模与仿真  

Semiconductor Assembly and Test Production Line Modeling and Simulation Based on CONWIP

作　　者：赵潇[1] 熊斐[2] 李晶[1] 李敬敏[1] 姚进[1] 

机构地区：[1]四川大学制造科学与工程学院,四川成都610065 [2]四川大学商学院,四川成都610065

出　　处：《机械设计与制造》2013年第9期1-4,共4页Machinery Design & Manufacture

基　　金：国家自然科学基金(51205264)

摘　　要：针对A企业半导体封装测试生产线CONWIP投料策略在实施过程中长期依靠人工经验估算来确定恒定健康在制品控制范围,从而导致在制品库存定量不恰当的问题,建立了半导体封装测试生产线仿真模型,以CONWIP控制范围为变量,以生产周期为系统评价指标进行仿真实验。仿真结果表明,建立的仿真模型在一定程度上较好地模拟了半导体封装测试生产线的特性,通过该模型可以确定恒定健康在制品库存数量的合理范围,为半导体封装测试生产活动提供可靠的数据支持,提高了生产决策的效率。Constant healthy work in process quantity is usually calculated by engineers based on their experiences when CONWIP policy is applied in semiconductor assembly and test production line of the A corporation, which may cause the quantity of work in process is not appropriate. In view of prablem above, it models the semiconductor assembly and test production line （ATPL）and simulates the model with independent variable CONWIP and dependent variable cycle time. The simulation result suggests that the simulation model have established can excellently reflects the characters of ATPL and constant healthy work in process quantity scope and can be decided by the model simulation, which can offer data support to production activities and improve decision-making efficiency.

关 键 词：半导体封装测试 在制品 建模 仿真 生产周期 

分 类 号：TH16[机械工程—机械制造及自动化] TN606[电子电信—电路与系统]