TFT-LCD玻璃基板的本构参数研究及其切割过程分析  

Study of TFT-LCD glass substrate constitutive parameters and analysis of its cutting process

作　　者：赵靖超[1] 王建花[2] 轧刚[1] 

机构地区：[1]太原理工大学机械工程学院,太原030024 [2]中国电子科技集团公司第二研究所,太原030024

出　　处：《现代制造工程》2013年第9期79-82,共4页Modern Manufacturing Engineering

基　　金：太原市战略性新兴产业重大自主创新项目(120118)

摘　　要：为解决切割TFT-LCD玻璃基板过程中裂纹动态扩展的不确定性,利用MATLAB软件建立切割过程的计算模型并融入JHC本构模型、玻璃基板材料力学性能和脆性材料力学特性,得出玻璃基板本构参数,并通过实际切割效果与理论仿真结果相结合的方法进一步完善本构参数,模拟切割过程,分析切割过程中影响刀轮受力与裂纹动态扩展的因素,为合理选择切割参数及刀具几何参数、保证玻璃切割质量提供了理论依据。In order to solve the uncertainty in the process of cutting TFF-LCD glass substrate, establishes the math model of cut- ting process combined with JHC model, mechanical properties of glass substrate and brittleness material mechanics properties by MATLAB software to obtain the constitutive parameters. Then these parameters are further modified and improved by comparing the actual to simulated results. The cutting process is analyzed to acquire the influence factors on the force applied on the cutter wheel and the cracks propagation process, that provides theory basis for choosing cutting parameters, geometric parameters of cut- ting wheels reasonably and guaranteeing the quality of cutting process.

关 键 词：切割 玻璃基板 JHC模型 脆性材料 本构参数 

分 类 号：TG669[金属学及工艺—金属切削加工及机床] TN141.9[电子电信—物理电子学]