基板焊盘的金属层结构对焊接点强度的影响  

Effect of Substrate Pad Metallization Structure on Strength of Solder Joint

作　　者：陶自春 张淑红[2] 

机构地区：[1]快捷半导体苏州有限公司,江苏苏州215021 [2]苏州工业职业技术学院机电工程系,江苏苏州215104

出　　处：《半导体技术》2013年第9期697-701,共5页Semiconductor Technology

摘　　要：球栅阵列封装具有高密度、低成本的特点被内存领域广泛采用。在实际的使用过程中由于遭受外界各种形式的机械负载和冲击造成器件失效,典型的失效模式有5类,突出问题是焊点失效,而焊点破裂是失效的主要形式。为了改善焊点的强度,提出了焊球的快速剪切测试以及BGA器件的快速剪切测试方法来检测焊点强度,设计了4种不同金属层结构的基板焊盘,对比了不同基板焊盘的快速剪切强度和失效模式。通过数据分析和失效模式研究,证明含较厚铜层或者镍层的焊盘具有更强的焊接强度。The ball grid array （BGA） package was widely used in memory products because of the high density package and low cost. Many failures caused by the mechanical load and shock were detected during the application, and among these failures, five failure modes were elaborated. Meanwhile, the common issue of this package type was the failure of the solder joint, and the major failure mode was the solder joint crack. In order to improve the solder joint robustness, four types of solder ball pads with different metalization structures were designed, and the fast ball shear test and package shear test method with Dage4000HS were elaborated. Shear test data and failure mode from these four solder pads show that thicker Cu or Ni layer can improve the solder joint strength.

关 键 词：球栅阵列（BGA） 金属间化合物（IMC） 基板 印刷电路板（PCB） 焊接点 

分 类 号：TN405[电子电信—微电子学与固体电子学]