工装材料对微波功率电路焊透率的影响  

Infuence of Fixture Materials on Soldering Area Ratio for Microwave Power Circuits

作　　者：左艳春[1] 刘刚[1] 朱庆[1] 

机构地区：[1]中国电子科技集团公司第十四研究所,江苏南京210013

出　　处：《电子工艺技术》2013年第5期276-278,共3页Electronics Process Technology

基　　金：总装预研项目(项目编号:115318150200)

摘　　要：微波电路板与微波底板的焊透率是影响微波组件性能的重要因素,工装材料是影响焊透率的重要因素。分别用不锈钢和铝合金材料的工装进行微波电路大面积焊接试验,探讨工装材料对试样焊透率的影响。试验结果表明,铝合金工装平均焊透率高于不锈钢工装,并且焊透率一致性好,空洞较小,更适合作为微波电路接地焊的工装材料。Soldering area ratio between microwave printed circuit board and substrate has important effect on performance of microwave modules which play key role in phased array radar. Fixture has important effect on soldering area ratio. Stainless steel fixture and aluminum fixture were used for large area soldering for microwave power circuits respectively. Soldering area percentage of the solder joints was studied. Results indicated samples soldered with aluminum fixture had smaller voids and showed better consistency than that with stainless steel fixture. So aluminum fixture is more suitable for large area soldering of microwave circuits than stainless steel fixture because aluminum alloy has lower thermal capacity, large thermal conductivity and better mechanical properties.

关 键 词：工装 大面积焊接 微波功率电路 铝合金 不锈钢 焊透率 

分 类 号：TN605[电子电信—电路与系统]