基于热传递的光发射次模块结温计算方法  

A Calculation Method for Junction Temperature of Transmitter Optical Sub-Assembly Based on Heat Transfer

作　　者：姜振超[1] 唐杰[2] 黄宏光[2] 

机构地区：[1]国网四川省电力公司电力科学研究院,四川成都610065 [2]四川大学电气信息学院,四川成都610065

出　　处：《四川电力技术》2013年第5期9-12,72,共5页Sichuan Electric Power Technology

基　　金：四川省科技支撑计划项目(2011GZ0004);四川省电力公司科技项目(11H0920)

摘　　要：由于技术和设备等条件限制,对于一些微小的元件,很难通过常规的测量方法得知其内部的温度情况。提供了一种针对小型封装可热插拔光收发一体模块(small form-factor pluggable,SFP)内部光发射次模块(transmitter optical sub-assembly,TOSA)的热学建模方法,通过对TOSA外壁的温度测量及封装材料的热学参数,利用傅里叶定律粗略估算其内部芯片结温,此方法也能对其他微小器件的热学分析提供参考。Due to the restrictions of technology and equipment, it is difficult to obtain the temperature inside with the conven- tional temperature measurement methods for some micro components. A thermal modeling method for transmitter optical sub - assembly （TOSA） module in small form -factor pluggable （SFP） is presented. Through the temperature measurement outside TOSA and the thermal parameters, the junction temperature of internal chip is estimated roughly with Fourier law. This method could also be used to thermal analysis for other kinds of micro devices.

关 键 词：TOSA SFP 傅里叶定律 热传导 对流传热 

分 类 号：TK711[动力工程及工程热物理—流体机械及工程]